
Highly efficient repair centre, allowing for a full range of repair activities: dismantling, reconstruction conclusions and seats and reassemble. It is completely convective, the repair center, making it the most gentle tool for complex printed circuit assemblies and components. Contactless solder removal gives the possibility of direct screen printing on components and boards, the possibility of soldering in a nitrogen atmosphere. Non-contact temperature measurement is the key components of highly reliable repair operations at the repair center FINEPLACER coreplus.

Fineplacer Pico is an universal, fully-convection repair center for installation and repair of printed circuit assemblies with any type of PMI. The most sold system for professional repair with high density. Fineplacer Pico is suitable for stages of development, Assembly, trial batches and production of serial products. Applications from chip components 01005 to BGA 40x40 mm for small and medium sized PP.